Effect of Pump-Induced Particle Agglomeration on CMP

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An investigation of pump-induced large particles and their impact on computer hard drive substrate CMP (chemical mechanical polishing) is summarized. Experiments have been performed to measure the particle agglomeration tendency during various pumping processes. The surface quality of NiP/Al substrates after CMP has been directly linked to the presence of these particles. The mechanism for formation and growth of these large particle sizes is elucidated in this study.

Author Yongqing Lan, Yuzhuo Li
Company St. Lawrence Nanotechnology
Pages 4