The cleaning process performance in both conventional wet-bath and a single-wafer processor was evaluated. Experiments performed in this study were primarily oriented toward the deter- mination of the number of particles added onto the wafer by using various pumping methods. In particular, the impact of pump-induced particles on silicon wafer cleaning in DI water was investigated. The random yield of ICs was estimated from the particle count data using various correlations including a negative binomial model.